Meet user & industry needs – cost-effectively &sustainably
BeFC® printed electronics turn-key services
Printed and hybrid electronics enable a new generation of devices, providing a paradigm shift to smaller, smarter, lighter, and more eco-friendly systems.
This new approach provides opportunities to rethink the entire life cycle of electronic products through material selection, manufacturing methods, and use of energy-efficient components, whilst setting a higher standard for recycling, reduction, and re-use.
However, the production of printed and hybrid electronics requires several manufacturing processes and tools.
BeFC provides a turn-key solution from design inception to upscaled manufacturing through its range of services, including the following capabilities:
Test laboratory with IoT source/load, high-precision current waveform analyser, network analyser, spectrum analyser, and anechoic chamber.
Multi-channel SMUs with wide range of climatic chambers for stress testing.
PCB layout suite with dedicated modules for printed electronics.
Experienced team with power, signal, and RF experience.
Schematic design and simulation software.§Antenna design suite.
[2] Sheet-to-sheet printing:
1 x high-precision (HP) screen printer.
2 x HP, high-throughput (HT) screen printers.
Systems compatible with different formats of stencils and screens.
Automated layer-to-layer registration.
2 x high-throughput ovens.
1 x UV LED system for dielectric curing.
HP = High-Precision; HT= High-Throughput
[3] Ink formulation:
Highly experienced team and state-of-the-art facilities for ink reformulation, dispersions including:
2 x dispersers to cover different particle size ranges.
1 x high-shear homogeniser with interchangeable wave guides for nanoemulsions & nanoencapsulation.
1 x ultrasonic probe.
Particle sizing and distribution via EAS***.
Rheometer.
***EAS = electroacoustic spectroscopy
[4] Roll-to-roll printing:
1 x Pilot line with interchangeable print heads to explore various analog print technologies.
1 x Industrial line for HT production.
HT drying & curing capacity with multi-zone control.
Both printing and coating processes.
Expert team with industrial experience.
Process development & quality control.
[5] Component assembly:
1 x high-throughput (HT) multi-component pick and place line for low-temperature soldering and/or adhesive bonding.
Flip-chip high-precision and bare-die assembly.
[6] Converting capabilities:
1 x versatile lamination and cutting converting line equipped with a cutting laser, and conveyor system.
Ultrasonic welding.
Thermal and/or pressurised sealing.
[7] Characterisation:
Additionally, for early screening and testing, there are off-line benchtop capabilities for all key processes used.
For test and validation purposes, characterisation capabilities range from material testing, dynamic mechanical stress testing, and profilometry to scanning electron microscopy.
[8] Support:
Freedom to Operate (FTO) studies.
Market inspection and evaluation.
Product integration.
System design.
Process scaling.
Electronic & mechanical testing.
Environmental stress testing.
BeFC® can deliver low-cost & low-environmental-impact advanced solutions. We have forged experience, expertise and capabilities that we now wish to share. The company is open to small ad hoc projects to full joint development agreements.
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